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Microelectronics

Custom Microelectronic Assemblies provide solutions to many applications that cannot be achieved with standard packaged products. From basic miniaturised circuits to complex multi-function packages, Welwyn utilises substrates, interconnect and packaging technologies that bring the following advantages over competing discrete component systems: reduced footprints, improvements in thermal management, reliability durability, electrical & noise performance
bullet  Ceramic bullet  Thick Film bullet  Metal Clad bullet  Photo-etch
bullet  Steel bullet  Aluminium bullet  LTCC bullet  SMT
bullet  Flipchip bullet  BGA bullet  Chip & Wire bullet  Thin Film
bullet  PCB Assemblies

For more information please click one of the steps in the diagram below.
MicroElectronicsProcessDiagram
ProductRealisation.asp ProcessInnovation.asp DesignQuality.asp ProactiveManagement.asp NextGenDesign.asp

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